CNC Silicon Ingot Cutting Saw
The CNC Silicon Ingot Cutting Saw is a numerically controlled multi-wire saw for slicing silicon ingots into brick sections prior to wafer slicing. Using diamond slurry wires for material removal, it qualifies as an NC sawing machine for semiconductor material processing under tariff item 8461.50.10.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
More Specific Codes
This product may fall under a more specific subheading:
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the machine is solely or principally used for the manufacture of semiconductor boules or wafers
Machines for semiconductor manufacture are classified in heading 84.86, which takes precedence over other headings.
If the machine is not numerically controlled
Non-NC sawing or cutting-off machines fall under the 'Other' subheading within the same tariff heading.
If the machine works on stone, ceramics, or similar mineral materials
Machines for working stone, ceramics, or similar materials are classified in heading 84.64, not in heading 84.61.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm the machine's primary function is sawing or cutting-off of metal or cermets, as wire saws for other materials may be classified elsewhere
• Provide the CBSA with specifications showing the machine's numerical control and cutting mechanism
• Check if the machine qualifies for duty relief under the Machinery Remission Program if used in semiconductor manufacturing
Related Products under Tariff item 8461.50.10
ADT 958 Sapphire Wafer Sawing System
A CNC-controlled precision sawing machine designed to cut-off synthetic sapphire wafers used in LED semiconductor production. It removes material using diamond blades and operates under numerical control, making it a sawing or cutting-off machine for working cermets.
CNC boule Notching Machine
The CNC boule Notching Machine is a numerically controlled precision saw or notcher that creates fiducial notches on silicon boules for wafer alignment in lithography. Its NC slotting or sawing function in semiconductor boule preparation places it under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
CNC Wafer Edge Profiling Machine
The CNC Wafer Edge Profiling Machine is a numerically controlled machine tool that profiles wafer edges to prevent chipping and ensure handling compatibility in semiconductor fabrication processes. Its cutting-off function on semiconductor wafers places it under tariff item 8461.50.10 as an NC sawing or cutting-off machine.
CNC Wafer Slicing Saw
The CNC Wafer Slicing Saw is a numerically controlled sawing machine designed to slice ultra-thin semiconductor wafers from monocrystalline silicon boules with precision tolerances. As an NC sawing machine for semiconductor material, it falls under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
DISCO DFD6360 Fully Automatic Dicing Saw
A fully automatic dicing saw with numerical control, used to saw semiconductor wafers into individual chips by removing material along scribe lines. It operates in back-end semiconductor processing and is a numerically controlled sawing machine for cutting-off cermet materials.
ESEC 2100 Wafer Sawing Platform
A modular numerically controlled sawing system for semiconductor wafer cutting-off operations. It is configurable for different cermet materials and operates as a sawing machine under numerical control, fitting the tariff item for NC sawing machines.