CNC Silicon Ingot Cutting Saw from Japan
The CNC Silicon Ingot Cutting Saw is a numerically controlled multi-wire saw for slicing silicon ingots into brick sections prior to wafer slicing. Using diamond slurry wires for material removal, it qualifies as an NC sawing machine for semiconductor material processing under tariff item 8461.50.10.
Duty Rate — Japan → Canada
0%
Import Tips
• Confirm the machine's primary function is sawing or cutting-off of metal or cermets, as wire saws for other materials may be classified elsewhere
• Provide the CBSA with specifications showing the machine's numerical control and cutting mechanism
• Check if the machine qualifies for duty relief under the Machinery Remission Program if used in semiconductor manufacturing