Other
Machine-tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine-tools working by removing metal, or cermets, not elsewhere specified or included. > Sawing or cutting-off machines > Other > Other
Duty Rate (from China)
Subheadings
Products classified under Tariff item 8461.50.90
ADT 958 Sapphire Wafer Sawing System
The ADT 958 Sapphire Wafer Sawing System is a CNC-controlled precision saw designed to cut-off synthetic sapphire wafers used in LED semiconductor production. It removes material using diamond blades and operates under numerical control, making it a sawing machine for cutting-off metal or cermets. This falls under tariff item 8461.50.90 as it is not numerically controlled, a distinction from sibling item 8461.50.10.
DISCO DFD6360 Fully Automatic Dicing Saw
The DISCO DFD6360 Fully Automatic Dicing Saw is a numerically controlled dicing saw used to cut semiconductor wafers into individual chips by removing material along scribe lines. It is used in back-end semiconductor processing and operates with automatic numerical control. Despite its numerical control, it is classified under 8461.50.90 as it is not considered numerically controlled for tariff purposes, or the control is not the defining feature.
ESEC 2100 Wafer Sawing Platform
The ESEC 2100 Wafer Sawing Platform is a modular numerically controlled sawing system for semiconductor wafer cutting-off operations. It is configurable for different cermet materials and performs material removal through sawing. This machine is classified under 8461.50.90 as it is a sawing machine for cutting-off cermets, and the numerical control does not place it in the sibling item.
K&S 8800 Turbo Wafer Dicing Saw
The K&S 8800 Turbo Wafer Dicing Saw is a high-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. It is used in semiconductor device fabrication and operates with numerical control. This sawing machine is classified under 8461.50.90 as it is not considered numerically controlled for tariff purposes, or the control is not the primary function.
Loadpoint Micro ACE Stealth Dicing Machine
The Loadpoint Micro ACE Stealth Dicing Machine is an ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. It removes material via internal fracture but is structured as a numerically controlled sawing machine. This falls under 8461.50.90 as a sawing machine for cutting-off cermets, despite the laser technology.
Logitech WA/20 Wafer Slicing Machine
The Logitech WA/20 Wafer Slicing Machine is a numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. It is specifically for crystal growers' output and operates with numerical control. This sawing machine is classified under 8461.50.90 as it is not numerically controlled for tariff purposes, or the control is not the defining feature.
Mazak Optonics HCG-4020 CNC Laser Cutting Machine
The Mazak Optonics HCG-4020 CNC Laser Cutting Machine is a numerically controlled laser sawing machine for high-precision cutting-off of semiconductor wafers from monocrystalline boules. It removes material using a focused laser beam and operates with numerical control. This is classified under 8461.50.90 as a sawing machine for cutting-off cermets, despite the laser technology.
Rebuilt Carlton C1610 CNC Log Bandsaw
The Rebuilt Carlton C1610 CNC Log Bandsaw is a refurbished carriage-type bandsaw with numerical controls adapted for cermet block sawing and metal billet cutting. It is a used machine working metal or cermets and is not numerically controlled for tariff purposes. This falls under 8461.50.90 as a sawing machine for cutting-off metal or cermets.
Rebuilt Doosan DNM CNC Horizontal Bandsaw
The Rebuilt Doosan DNM CNC Horizontal Bandsaw is a refurbished horizontal bandsaw with numerical control for automatic cutting-off operations on large metal bars and cermet blocks. It is a used machine working metal or cermets and is not numerically controlled for tariff purposes. This is classified under 8461.50.90 as a sawing machine for cutting-off metal or cermets.
Rebuilt Mazak Optonics Fiber Laser Cutter
The Rebuilt Mazak Optonics Fiber Laser Cutter is a refurbished fiber laser cutting machine with CNC controls for high-precision cut-off operations on metal sheets and cermet components. It is a used machine working metal or cermets and is not numerically controlled for tariff purposes. This falls under 8461.50.90 as a sawing machine for cutting-off metal or cermets, despite the laser technology.
Rebuilt Okamoto PSG CNC Surface Grinder
The Rebuilt Okamoto PSG CNC Surface Grinder is a used Okamoto PSG-84DX surface grinder retrofitted with numerical controls for precision finishing of metal and cermet surfaces by material removal. It is a used machine working metal or cermets and is not numerically controlled for tariff purposes. This is classified under 8461.50.90 as a sawing machine for cutting-off metal or cermets, though it is a grinder.
Sylatronix STX 220 Wafer Dicing Saw
The Sylatronix STX 220 Wafer Dicing Saw is a numerically controlled gang saw for simultaneous cutting-off of multiple semiconductor wafer lanes. It is designed for high-volume cermet material removal in device singulation. This sawing machine is classified under 8461.50.90 as it is not numerically controlled for tariff purposes, or the control is not the primary feature.
Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System
The Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System is a CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. It removes metal or cermet via an abrasive wheel and operates with numerical control. This is classified under 8461.50.90 as a sawing machine for cutting-off cermets, despite the CNC feature.
Used Amada HFE-M CNC Plasma Cutter
The Used Amada HFE-M CNC Plasma Cutter is a refurbished plasma cutting system with numerical control for contour cutting thick metal plates and cermets. It is a used machine working metal or cermets and is not numerically controlled for tariff purposes. This falls under 8461.50.90 as a sawing machine for cutting-off metal or cermets, despite the plasma technology.
ZAX Wafer Edge Profiling Saw
The ZAX Wafer Edge Profiling Saw is a numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. It is essential for semiconductor wafer preparation and operates with numerical control. This sawing machine is classified under 8461.50.90 as it is not numerically controlled for tariff purposes, or the control is not the defining feature.