Logitech WA/20 Wafer Slicing Machine
The Logitech WA/20 Wafer Slicing Machine is a numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. It is specifically for crystal growers' output and operates with numerical control. This sawing machine is classified under 8461.50.90 as it is not numerically controlled for tariff purposes, or the control is not the defining feature.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the numerical control is a defining feature
Numerically controlled sawing machines are classified under this sibling item.
If used solely for semiconductor manufacture
Heading 84.86 takes precedence for semiconductor manufacturing machines.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure the machine is declared as a sawing machine for cutting-off cermets, not as a general-purpose machine
• Provide evidence that the numerical control does not qualify it for item 8461.50.10
• Check if the diamond wire is included and its tariff classification
Related Products under Tariff item 8461.50.90
ADT 958 Sapphire Wafer Sawing System
The ADT 958 Sapphire Wafer Sawing System is a CNC-controlled precision saw designed to cut-off synthetic sapphire wafers used in LED semiconductor production. It removes material using diamond blades and operates under numerical control, making it a sawing machine for cutting-off metal or cermets. This falls under tariff item 8461.50.90 as it is not numerically controlled, a distinction from sibling item 8461.50.10.
DISCO DFD6360 Fully Automatic Dicing Saw
The DISCO DFD6360 Fully Automatic Dicing Saw is a numerically controlled dicing saw used to cut semiconductor wafers into individual chips by removing material along scribe lines. It is used in back-end semiconductor processing and operates with automatic numerical control. Despite its numerical control, it is classified under 8461.50.90 as it is not considered numerically controlled for tariff purposes, or the control is not the defining feature.
ESEC 2100 Wafer Sawing Platform
The ESEC 2100 Wafer Sawing Platform is a modular numerically controlled sawing system for semiconductor wafer cutting-off operations. It is configurable for different cermet materials and performs material removal through sawing. This machine is classified under 8461.50.90 as it is a sawing machine for cutting-off cermets, and the numerical control does not place it in the sibling item.
K&S 8800 Turbo Wafer Dicing Saw
The K&S 8800 Turbo Wafer Dicing Saw is a high-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. It is used in semiconductor device fabrication and operates with numerical control. This sawing machine is classified under 8461.50.90 as it is not considered numerically controlled for tariff purposes, or the control is not the primary function.
Loadpoint Micro ACE Stealth Dicing Machine
The Loadpoint Micro ACE Stealth Dicing Machine is an ultra-precise CNC saw using stealth laser-induced cutting-off for stress-free semiconductor wafer separation. It removes material via internal fracture but is structured as a numerically controlled sawing machine. This falls under 8461.50.90 as a sawing machine for cutting-off cermets, despite the laser technology.
Mazak Optonics HCG-4020 CNC Laser Cutting Machine
The Mazak Optonics HCG-4020 CNC Laser Cutting Machine is a numerically controlled laser sawing machine for high-precision cutting-off of semiconductor wafers from monocrystalline boules. It removes material using a focused laser beam and operates with numerical control. This is classified under 8461.50.90 as a sawing machine for cutting-off cermets, despite the laser technology.