Logitech WA/20 Wafer Slicing Machine from Mexico
The Logitech WA/20 Wafer Slicing Machine is a numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. It is specifically for crystal growers' output and operates with numerical control. This sawing machine is classified under 8461.50.90 as it is not numerically controlled for tariff purposes, or the control is not the defining feature.
Duty Rate — Mexico → Canada
0%
Import Tips
• Ensure the machine is declared as a sawing machine for cutting-off cermets, not as a general-purpose machine
• Provide evidence that the numerical control does not qualify it for item 8461.50.10
• Check if the diamond wire is included and its tariff classification