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Used Amada HFE-M CNC Plasma Cutter

The Used Amada HFE-M CNC Plasma Cutter is a refurbished plasma cutting system with numerical control for contour cutting thick metal plates and cermets. It is a used machine working metal or cermets and is not numerically controlled for tariff purposes. This falls under 8461.50.90 as a sawing machine for cutting-off metal or cermets, despite the plasma technology.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFreeβ€”Free
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡ΊπŸ‡ΈUnited StatesFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8456.90.00Same rate: Free

If the plasma cutting is not considered sawing

Plasma cutting machines for working metal or cermets are classified under heading 84.56.

8461.50.10Same rate: Free

If the numerical control is a defining feature

Numerically controlled sawing machines are classified under this item.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item β€” and can price the duty on it in the same conversation.

Import Tips & Compliance

β€’ Clarify with CBSA that the plasma cutting is considered sawing for tariff purposes, as plasma cutting machines may fall under heading 84.56

β€’ Provide technical specifications on the material removal process

β€’ Verify if the numerical control affects classification

Related Products under Tariff item 8461.50.90

ADT 958 Sapphire Wafer Sawing System

The ADT 958 Sapphire Wafer Sawing System is a CNC-controlled precision saw designed to cut-off synthetic sapphire wafers used in LED semiconductor production. It removes material using diamond blades and operates under numerical control, making it a sawing machine for cutting-off metal or cermets. This falls under tariff item 8461.50.90 as it is not numerically controlled, a distinction from sibling item 8461.50.10.

DISCO DFD6360 Fully Automatic Dicing Saw

The DISCO DFD6360 Fully Automatic Dicing Saw is a numerically controlled dicing saw used to cut semiconductor wafers into individual chips by removing material along scribe lines. It is used in back-end semiconductor processing and operates with automatic numerical control. Despite its numerical control, it is classified under 8461.50.90 as it is not considered numerically controlled for tariff purposes, or the control is not the defining feature.

ESEC 2100 Wafer Sawing Platform

The ESEC 2100 Wafer Sawing Platform is a modular numerically controlled sawing system for semiconductor wafer cutting-off operations. It is configurable for different cermet materials and performs material removal through sawing. This machine is classified under 8461.50.90 as it is a sawing machine for cutting-off cermets, and the numerical control does not place it in the sibling item.

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