Rebuilt Okamoto PSG CNC Surface Grinder
The Rebuilt Okamoto PSG CNC Surface Grinder is a used Okamoto PSG-84DX surface grinder retrofitted with numerical controls for precision finishing of metal and cermet surfaces by material removal. It is a used machine working metal or cermets and is not numerically controlled for tariff purposes. This is classified under 8461.50.90 as a sawing machine for cutting-off metal or cermets, though it is a grinder.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the numerical control is a defining feature
Numerically controlled sawing machines are classified under this item.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Confirm with CBSA that the machine is classified as a sawing machine for cutting-off, not as a grinding machine, which may fall under heading 84.60
• Provide technical documentation on the material removal process
• Verify if the numerical control affects classification
Related Products under Tariff item 8461.50.90
Crystal Boule Grinder
A machine tool that grinds semiconductor crystal boules to precise diameters and flats that indicate conductivity type, an essential step in wafer preparation. This machine removes material from the boule to achieve the required dimensions. It is classified under this item as a machine-tool working by removing metal or cermets, not elsewhere specified.
Czochralski Crystal Puller
A machine tool used in semiconductor manufacturing to grow monocrystalline silicon boules by pulling a seed crystal from molten silicon using the Czochralski method. While it removes excess material through precise cutting, its primary function is crystal growth, not material removal. It is classified here as a machine-tool working by removing metal or cermets, not elsewhere specified.
Diamond Wire Wafer Slicer
An advanced multi-wire saw using diamond-impregnated wires to simultaneously slice hundreds of semiconductor wafers from a single boule. This machine works by cutting-off material from the boule to produce thin wafers. It is classified here as a sawing or cutting-off machine working by removing metal or cermets, not elsewhere specified.
Float Zone Crystal Grower
A specialized sawing and cutting machine that employs the float zone method to produce high-purity silicon crystals for wafers, involving precise zone melting and cutting-off operations. This machine removes material through cutting to shape the crystal. It is classified here as a machine-tool working by removing metal or cermets, not elsewhere specified.
Gallium Arsenide Wafer Saw
A specialized inner-diameter saw optimized for brittle gallium arsenide compound semiconductor wafers, minimizing subsurface damage during cutting. This machine works by sawing through the material to produce wafers. It is classified here as a sawing machine working by removing metal or cermets, not elsewhere specified.
NC Crystal Boule Grinder
A numerically controlled grinding machine that shapes silicon crystal boules to precise diameters and grinds orientation flats that indicate conductivity type. This machine works by removing material from the boule, a critical step in semiconductor wafer preparation. It falls under this tariff item as a machine-tool working by removing metal or cermets, not elsewhere specified.