Numerically controlled
Machine-tools for planing, shaping, slotting, broaching, gear cutting, gear grinding or gear finishing, sawing, cutting-off and other machine-tools working by removing metal, or cermets, not elsewhere specified or included. > Sawing or cutting-off machines > Numerically controlled > Numerically controlled
Duty Rate (from China)
Products classified under Tariff item 8461.50.10.00
ADT 958 Sapphire Wafer Sawing System
A CNC-controlled precision sawing machine designed to cut-off synthetic sapphire wafers used in LED semiconductor production. It removes material using diamond blades and operates under numerical control, making it a sawing or cutting-off machine for working cermets.
8461.50.10CNC boule Notching Machine
The CNC boule Notching Machine is a numerically controlled precision saw or notcher that creates fiducial notches on silicon boules for wafer alignment in lithography. Its NC slotting or sawing function in semiconductor boule preparation places it under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
8461.50.10CNC Silicon Ingot Cutting Saw
The CNC Silicon Ingot Cutting Saw is a numerically controlled multi-wire saw for slicing silicon ingots into brick sections prior to wafer slicing. Using diamond slurry wires for material removal, it qualifies as an NC sawing machine for semiconductor material processing under tariff item 8461.50.10.
8461.50.10CNC Wafer Edge Profiling Machine
The CNC Wafer Edge Profiling Machine is a numerically controlled machine tool that profiles wafer edges to prevent chipping and ensure handling compatibility in semiconductor fabrication processes. Its cutting-off function on semiconductor wafers places it under tariff item 8461.50.10 as an NC sawing or cutting-off machine.
8461.50.10CNC Wafer Slicing Saw
The CNC Wafer Slicing Saw is a numerically controlled sawing machine designed to slice ultra-thin semiconductor wafers from monocrystalline silicon boules with precision tolerances. As an NC sawing machine for semiconductor material, it falls under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
8461.50.10DISCO DFD6360 Fully Automatic Dicing Saw
A fully automatic dicing saw with numerical control, used to saw semiconductor wafers into individual chips by removing material along scribe lines. It operates in back-end semiconductor processing and is a numerically controlled sawing machine for cutting-off cermet materials.
8461.50.10ESEC 2100 Wafer Sawing Platform
A modular numerically controlled sawing system for semiconductor wafer cutting-off operations. It is configurable for different cermet materials and operates as a sawing machine under numerical control, fitting the tariff item for NC sawing machines.
8461.50.10K&S 8800 Turbo Wafer Dicing Saw
A high-speed numerically controlled dicing saw for cutting-off semiconductor wafers into dies, removing kerf material during the process. It is used in semiconductor device fabrication and qualifies as a numerically controlled sawing machine.
8461.50.10Loadpoint Micro ACE Stealth Dicing Machine
The Loadpoint Micro ACE Stealth Dicing Machine is an ultra-precise numerically controlled saw that uses stealth laser-induced cutting-off for stress-free separation of semiconductor wafers. Although material removal occurs via internal fracture, the machine is structured as an NC sawing machine, which qualifies it under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
8461.50.10Logitech WA/20 Wafer Slicing Machine
A numerically controlled diamond wire saw for slicing semiconductor boules into thin wafers by material removal. It is specifically used for crystal growers' output and is a numerically controlled sawing machine for cutting-off cermet materials.
8461.50.10Mazak Optonics HCG-4020 CNC Laser Cutting Machine
The Mazak Optonics HCG-4020 CNC Laser Cutting Machine is a numerically controlled laser sawing machine designed for high-precision cutting-off of semiconductor wafers from monocrystalline boules. It removes material using a focused laser beam, and its NC control and cutting-off function place it under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
8461.50.10NC Float Zone Wafer Saw
The NC Float Zone Wafer Saw is a specialized numerically controlled saw for cutting wafers from float zone grown silicon boules used in power semiconductors. As an NC cutting-off machine for semiconductor material, it falls under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
8461.50.10Rebuilt Carlton C1610 CNC Log Bandsaw
A refurbished Carlton carriage-type bandsaw with numerical controls adapted for cermet block sawing and metal billet cutting. It is a used numerically controlled sawing machine working on metal or cermets, fitting the tariff item.
8461.50.10Rebuilt Doosan DNM CNC Horizontal Bandsaw
A refurbished Doosan horizontal bandsaw with numerical control for automatic cutting-off operations on large metal bars and cermet blocks. It is a used numerically controlled sawing machine working on metal or cermets.
8461.50.10Rebuilt Mazak Optonics Fiber Laser Cutter
A refurbished Mazak fiber laser cutting machine with CNC controls for high-precision cut-off operations on metal sheets and cermet components. It is a used numerically controlled cutting-off machine working on metal or cermets.
8461.50.10Sylatronix STX 220 Wafer Dicing Saw
A numerically controlled gang saw for simultaneous cutting-off of multiple semiconductor wafer lanes. It is designed for high-volume cermet material removal in device singulation and qualifies as a numerically controlled sawing machine.
8461.50.10Tokyo Seimitsu ACCUPEX 300 Wafer Cutting System
A CNC peripheral sawing machine for high-precision cutting-off of semiconductor wafers from edges or for shaping. It removes metal or cermet via an abrasive wheel and is classified as a numerically controlled sawing machine.
8461.50.10Used Amada HFE-M CNC Plasma Cutter
A refurbished Amada HFE-M series plasma cutting system with numerical control for contour cutting thick metal plates and cermets. It is a used numerically controlled cutting-off machine working on metal or cermets.
8461.50.10Used Bridgeport Series I CNC Milling-Sawing Combo
A refurbished Bridgeport Series I knee mill upgraded with CNC and sawing attachment for slotting and cutting-off metal or cermet workpieces. It is a used numerically controlled machine tool for metal or cermet removal.
8461.50.10Used Grob G350 CNC Slotting Machine
A rebuilt Grob G350 oscillating slotter with CNC for keyway and spline cutting in metal or cermet shafts by material removal. It is a used numerically controlled slotting machine working on metal or cermets.
8461.50.10Used Haas VF-2 CNC Band Saw
The Used Haas VF-2 CNC Band Saw is a rebuilt vertical band saw equipped with numerical control for precision cutting of metal and cermet materials in industrial workshops. As a used or rebuilt NC sawing machine, it falls under tariff item 8461.50.10 for numerically controlled sawing or cutting-off machines.
8461.50.10ZAX Wafer Edge Profiling Saw
A numerically controlled saw for cutting-off and profiling wafer edges to precise geometry by material removal. It is essential for semiconductor wafer preparation and qualifies as a numerically controlled sawing machine.