Of copper alloys
Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials), of a thickness (excluding any backing) not exceeding 0.15 mm. > Backed: > Of copper alloys > Of copper alloys
Duty Rate (from China)
Products classified under Tariff item 7410.2
1.6mm Double-Sided FR4 Copper Clad Laminate
Standard 1.6 mm thick double-sided copper clad laminate with FR-4 glass epoxy substrate and 1 oz refined copper foil on both sides. Each foil layer is 0.035 mm thick, well under the 0.15 mm limit. This product is used for prototyping and production PCBs and falls under tariff item 7410.21.00.
7410.21.001oz/1oz Double-Sided FR4 Copper Clad Laminate
Double-sided FR4 copper clad laminate with 1 oz copper weight per side, totaling 70 μm of copper foil thickness, well under 0.15 mm. The glass epoxy base provides structural support for general purpose rigid PCBs. This product falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.002-Layer PCB Copper Clad Laminate Panel
Standard panel-sized double-sided copper clad laminate for 2-layer PCB production, featuring a 1.6 mm FR-4 glass epoxy core with 1 oz refined copper on both sides. The copper foil thickness is within the 0.15 mm limit. This essential raw material for electronic assembly falls under tariff item 7410.21.00.
7410.21.00Aluminum-Backed Copper Clad Laminate
Aluminum-backed copper clad laminate consisting of refined copper foil laminated to a thin aluminum substrate, used for metal-core PCBs in LED lighting. The copper foil thickness does not exceed 0.15 mm, and the aluminum backing is considered a similar backing material under the heading.
7410.21.00Aluminum-Backed Copper Clad Laminate for LEDs
Aluminum-backed copper clad laminate used in LED manufacturing, consisting of an aluminum substrate bonded to refined copper foil no thicker than 0.15 mm. The copper layer forms the circuitry traces while the aluminum base dissipates heat in high-power LED applications. It is classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Aluminum-Backed Copper Clad? No - Double Copper FR4
Pure double-sided refined copper clad FR4 laminate with no metal core, using plastics-impregnated glass base with 0.5 oz copper on both sides. The copper foil thickness is well under 0.15 mm. This essential electronics industry raw material for high-volume PCB fabrication falls under tariff item 7410.21.00.
7410.21.00BT Resin Copper Clad Laminate for IC Substrates
BT resin copper clad laminate for IC substrates, featuring ultra-thin refined copper foil of 0.15 mm or less on a bismaleimide-triazine resin backing. It is engineered for semiconductor packaging substrates requiring high-density interconnect capability. This product falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00CEM-1 Copper Clad Board
CEM-1 copper clad board with a phenolic paper substrate and refined copper foil cladding not exceeding 0.15 mm, used for single-sided PCBs. The paper and resin backing qualifies as a similar backing material under the heading.
7410.21.00CEM-1 Copper Clad Laminate Panels
CEM-1 copper clad laminate panels consisting of a composite epoxy material core clad with refined copper foil on one or both sides, with foil thickness not exceeding 0.15 mm. These panels are used for single- and double-sided PCB prototypes and low-cost circuit board production. They are classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00CEM-1 Double-Sided Copper Clad Board
Double-sided copper clad laminate using CEM-1 phenolic resin and glass fiber composite base, with refined copper foil laminated on both sides. The copper foil thickness does not exceed 0.15 mm. This common substrate for single and double-layer PCBs falls under tariff item 7410.21.00.
7410.21.00Copper Clad Invincible Glass Laminate
Copper clad invincible glass laminate, a thin glass-reinforced substrate clad with refined copper foil of 0.15 mm or less, designed for rigid-flex hybrid PCBs. The innovative glass backing provides dimensional stability and thermal performance for advanced circuit applications. It is classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Copper Clad Invincible Laminate for RF
Specialty ceramic-filled laminate for RF applications with refined copper cladding ≤0.15 mm thickness. The ceramic-filled polymer backing is a similar backing material, making it classifiable under this tariff item.
7410.21.00Copper Clad Kapton Laminate for Aerospace
Copper clad Kapton laminate for aerospace applications, consisting of Kapton polyimide film backed with refined copper foil under 0.15 mm thick. This flexible laminate withstands extreme temperatures and vibration, making it suitable for high-reliability aerospace flexible circuits. It falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Double-Sided 1.6mm FR4 Copper Clad Laminate
Double-sided 1.6mm FR4 copper clad laminate with refined copper foil on both sides, each foil layer under 0.15 mm. The FR4 glass-epoxy substrate serves as the backing material, and the product is used for standard PCB fabrication.
7410.21.00Double-Sided 1oz Copper Clad FR4 Panels
Double-sided 1oz copper clad FR4 panels, standard glass epoxy panels with 35 µm refined copper foil clad on both sides, well within the 0.15 mm limit. These panels are the core material for multilayer PCB fabrication and general circuit board production. They are classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00FR-4 Copper Clad Laminate Double-Sided
Double-sided copper clad laminate made with FR-4 epoxy resin impregnated glass fiber base, featuring refined copper foil on both sides with thickness not exceeding 0.15 mm. This foundational material for PCB manufacturing falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00FR-4 Copper Clad Laminate Sheet
FR-4 copper clad laminate sheet made from epoxy fiberglass substrate clad with thin refined copper foil on one or both sides, thickness under 0.15 mm excluding backing. The FR-4 substrate is a plastics-based backing material.
7410.21.00Halogen-Free FR4 Double Copper Clad Laminate
Eco-friendly halogen-free FR4 double-sided copper clad laminate with flame-retardant plastics-impregnated glass fabric and refined copper foil on both sides. The copper foil thickness is under 0.15 mm. This RoHS-compliant product for consumer electronics falls under tariff item 7410.21.00.
7410.21.00High-Tg Copper Clad Laminate for Automotive PCBs
High-Tg copper clad laminate for automotive PCBs, made with high glass transition temperature FR4 and refined copper foil of 0.15 mm or less. It is engineered to perform under extreme conditions found in automotive electronics, including heat and vibration. This product is classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00High-Tg FR4 Copper Clad Laminate
High-Tg FR4 copper clad laminate with high glass transition temperature for lead-free soldering, clad with refined copper foil <0.15 mm. The high-Tg FR4 substrate is a plastics-based backing, making it classifiable under this tariff item.
7410.21.00High Tg FR4 Double-Sided Copper Clad Sheet
High glass transition temperature (Tg 170°C+) FR4 double-sided copper clad laminate with refined copper foil on plastics-impregnated glass cloth base. The copper foil thickness does not exceed 0.15 mm. Designed for lead-free soldering processes, this product falls under tariff item 7410.21.00.
7410.21.00Hybrid Copper Clad Laminate FR4-PTFE
Hybrid copper clad laminate combining FR4 and PTFE cores with refined copper foil of 0.15 mm or less, designed for mixed-signal PCBs. This hybrid stackup balances cost and performance for applications requiring both digital and RF circuitry. It falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Megtron6 Copper Clad Laminate for Servers
Megtron6 copper clad laminate for servers, a low-loss laminate with refined copper foil of 0.15 mm or less, designed for high-speed server and data center PCBs. The advanced backing material ensures signal integrity at high frequencies. It is classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Polyimide Copper Clad Laminate
Polyimide copper clad laminate with high-temperature polyimide film backed with refined copper foil ≤0.15 mm thick, used for flexible PCBs. The polyimide film is a plastics backing material, fitting the tariff item's scope.
7410.21.00Polyimide Copper Clad Laminate for Flex PCBs
Polyimide copper clad laminate for flex PCBs, consisting of a polyimide film backing clad with refined copper foil of 0.15 mm or less. The copper layer provides conductive paths while the polymer backing enables flexibility for flexible printed circuits. This product is classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Polyimide Glass Double-Sided Copper Clad
High-temperature polyimide resin with glass fabric double-sided copper clad laminate, featuring refined copper foil at 0.15 mm or less on both sides. This product is used in aerospace and military PCBs requiring 260°C+ performance. Classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Rogers 4003C Double-Sided Copper Laminate
Rogers 4003C high-frequency double-sided copper clad laminate featuring ceramic-filled plastics-impregnated glass reinforcement with refined copper foil on both sides. The copper foil thickness is 0.15 mm or less. Used in RF/microwave PCBs for wireless applications, this product falls under tariff item 7410.21.00.
7410.21.00Rogers RO4000 Series Copper Clad Laminate
Rogers RO4000 series copper clad laminate with PTFE-based backing and refined copper foil <0.15 mm for RF/microwave PCBs. The PTFE backing is a plastics material, making it classifiable under this tariff item.
7410.21.00Single-Sided 0.8mm FR4 PCB Laminate
Thin 0.8mm FR4 copper clad laminate with copper on one side only over glass fabric impregnated with epoxy resin, foil <0.15 mm thick. The FR4 backing is a plastics-impregnated glass material, fitting the tariff item.
7410.21.00Single-Sided 1.6mm FR4 Copper Laminate
Standard 1.6mm thick FR4 glass-epoxy laminate with 1 oz copper foil (35µm) on one side only, total foil thickness <0.15 mm. The FR4 backing is a plastics-impregnated glass material, making it classifiable under this tariff item.
7410.21.00Single-Sided 1oz FR4 Copper Clad Board
1 oz (35 micron) copper foil on one side of FR4 (glass cloth/epoxy) board, excluding backing <0.15 mm. The FR4 backing is a plastics-impregnated glass material, fitting the tariff item's scope.
7410.21.00Single-Sided 7628 Glass Cloth Copper Clad
Heavy 7628 glass cloth style impregnated with epoxy, clad with refined copper on one side only, foil thickness ≤0.15 mm. The glass cloth and epoxy backing is a plastics-impregnated glass material, making it classifiable under this tariff item.
7410.21.00Single-Sided CEM-1 Copper Clad Sheet
Copper foil laminated on one side to CEM-1 substrate (phenolic resin with glass mat and paper), thickness ≤0.15 mm. The CEM-1 backing is a composite material, fitting the tariff item's scope for backed refined copper foil.
7410.21.00Single-Sided Copper Clad Laminate Panel
Single-sided copper clad laminate panel with refined copper foil on one side only, thickness ≤0.15 mm, cut to size for PCB fabrication. The epoxy laminate backing is a plastics-based material, fitting the tariff item.
7410.21.00Single-Sided Epoxy Glass Copper Foil Panel
Single-sided copper foil panel consisting of refined copper foil laminated onto an epoxy-impregnated woven glass fiber base. The copper foil thickness does not exceed 0.15 mm, and the panel is used as a base material for printed circuit board production. This product falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Single-Sided FR4 Copper Clad Laminate
FR4 copper clad laminate sheet with refined copper foil on one side only, laminated onto a flame-retardant epoxy resin impregnated glass cloth base. The copper foil thickness is under 0.15 mm excluding the backing. This product is classified as backed copper foil of refined copper under tariff item 7410.21.00.
7410.21.00Single-Sided G10 Copper Clad Laminate
High-pressure G10 laminate with refined copper foil on one side, using an epoxy glass cloth base. The copper foil thickness does not exceed 0.15 mm. This copper clad laminate is used in industrial applications and falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Single-Sided Glass Epoxy CCL for LED Drivers
Specialized single-sided copper clad laminate on glass-epoxy substrate designed for LED driver circuits. The refined copper foil is on one side only, with thickness under 0.15 mm. This product falls under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Single-Sided Halogen-Free FR4 Copper Laminate
Halogen-free FR4 laminate with single-side refined copper foil under 0.15 mm thickness, using glass fabric fully impregnated with eco-friendly resin. This copper clad laminate is used in environmentally-conscious electronics manufacturing. Classified under tariff item 7410.21.00 as backed copper foil of refined copper.
7410.21.00Thin Flex Copper Clad Polyimide Laminate
Ultra-thin polyimide copper clad laminate for flexible circuits, with refined copper foil ≤0.15 mm and adhesive backing. The polyimide and adhesive layers are plastics-based backing materials, making it classifiable under this tariff item.
7410.22.00Brass Circuit Foil with PET Backing
Brass circuit foil with PET backing, 0.14 mm thick, pre-printed for PCB prototyping. This is a copper-zinc alloy foil backed with plastic, meeting the tariff item's requirement of backed copper alloy foil not exceeding 0.15 mm in thickness (excluding backing).
7410.22.00Brass Decorative Foil Laminated Paperboard
Brass decorative foil laminated to paperboard, 0.09 mm thick, used for book covers and packaging. The copper-zinc alloy foil is backed with paperboard, fitting the tariff item's scope of backed copper alloy foil with thickness not exceeding 0.15 mm.
7410.22.00Brass Foil Backed with Paper
Brass foil backed with paper, 0.12 mm thick, for electrical insulation applications. This copper-zinc alloy foil with paper backing falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm in thickness.
7410.22.00Brass Foil Paper Backed for Crafts
Brass foil paper backed for crafts, 0.04 mm thick, used in arts and crafts embossing. This thin copper-zinc alloy foil with paper backing qualifies under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Brass Foil with Paperboard for Gaskets
Brass foil backed with paperboard for composite gasket material, 0.10 mm thick. This copper-zinc alloy foil with paperboard backing falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm in thickness.
7410.22.00Bronze Foil Backed for RFI Shielding
Bronze foil backed for RFI shielding, 0.15 mm max, with plastic backing for RFI/EMI shielding gaskets. This copper-tin alloy foil with plastic backing falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Bronze Foil with Plastic Backing
Bronze foil with plastic backing, 0.10 mm thick, for flexible circuit boards. This copper-tin alloy foil backed with plastic film falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Copper Alloy Foil Composite Backing
Copper alloy foil composite backing, 0.12 mm thick, with composite paper/plastic backing for shielding. This brass foil with composite backing falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Copper-Nickel Foil with Polymer Backing
Copper-nickel foil with polymer backing, 0.11 mm thick, for corrosion-resistant laminates. This copper-nickel base alloy foil backed with polymer film falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Nickel Brass Hybrid Foil Backed
Nickel brass hybrid foil backed, 0.09 mm thick, with plastic backing. This copper-zinc-nickel alloy foil, borderline between brass and nickel silver, falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Nickel Silver Foil Paper-Backed
Nickel silver foil paper-backed, 0.08 mm thick, backed with paperboard for decorative laminates. This copper-nickel-zinc alloy foil with paperboard backing falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Nickel Silver Printed Foil Plastic Backed
Nickel silver printed foil plastic backed, 0.07 mm thick, for membrane switches. This etched copper-nickel-zinc alloy foil with plastic backing falls under the tariff item as printed backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Phosphor Bronze Flexible Foil PET Laminated
Phosphor bronze flexible foil PET laminated, 0.06 mm thick, for bellows material. This copper-tin-phosphorus alloy foil with PET lamination falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Phosphor Bronze Foil Adhesive Backed
Phosphor bronze foil adhesive backed, 0.05 mm thick, with adhesive plastic backing for shielding tapes. This copper-tin-phosphorus alloy foil with plastic backing falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.
7410.22.00Tin Bronze Foil with Insulation Backing
Tin bronze foil with insulation backing, 0.13 mm thick, with plastic insulation backing for flexible heaters. This high-tin bronze foil falls under the tariff item as backed copper alloy foil not exceeding 0.15 mm.