Toshiba THGAMRG8T13BAIL 128GB eMMC 5.1 NAND IC

eMMC 5.1 controller-integrated NAND flash memory for IoT devices and wearables offering sequential read speeds over 250MB/s. HTS 8542.32.00 for this memory IC.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFree+50.0%50%
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡¨πŸ‡¦CanadaFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8523.52.00Lower: 35% vs 50%

If meeting full solid-state storage device criteria

Chapter note (a) captures assembled flash storage.

8471.41.01Lower: 32.5% vs 50%

If as part of complete portable ADP storage units

Assembled SSDs for computers classify under 8471.41.

9031.80.80Lower: 35% vs 50%

If for measuring/displaying ICs in instruments

Specialized ICs for measurement apparatus shift headings.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

β€’ Certify controller-memory integration details; prepare for technical CBP rulings on eMMC vs discrete NAND; monitor volatility in flash pricing for valuation

Related Products under HTS 8542.32.00

Samsung K4B2G1646G-BCK0 8Gb DDR3L SDRAM Chip

This is a monolithic electronic integrated circuit memory chip using DDR3L SDRAM technology for high-speed data access in computers and servers. It falls under HTS 8542.32.00 as it is specifically classified as a memory integrated circuit, distinct from processors or other IC types.

Micron MT40A512M16HA-083E 8GB DDR4 SDRAM IC

A high-performance DDR4 synchronous dynamic random access memory integrated circuit used in laptops and data centers for temporary data storage. Classified under HTS 8542.32.00 as a dedicated memory IC with volatile storage capabilities.

Kingston EMMC 64GB NAND Flash Memory Chip

Embedded MultiMediaCard (eMMC) using 3D NAND flash technology for non-volatile storage in smartphones and tablets. HTS 8542.32.00 applies to this memory-specific integrated circuit before module assembly.

Intel 64GB Optane 3D XPoint Memory IC

Next-generation non-volatile memory integrated circuit using 3D XPoint technology for persistent storage with DRAM-like speeds in enterprise servers. Falls under HTS 8542.32.00 as a specialized memory IC.

SK Hynix H9HCNNNBDMMMR 16Gb LPDDR4X DRAM Chip

Low-power DDR4X synchronous DRAM IC optimized for mobile devices and automotive applications requiring efficient volatile memory. Classified in HTS 8542.32.00 for memory integrated circuits.

Western Digital 128GB 3D TLC NAND Flash IC

Triple-level cell 3D NAND flash memory die for high-capacity non-volatile storage in SSDs and embedded systems. HTS 8542.32.00 covers this as a memory-specific electronic integrated circuit.