Qualcomm MSM8998 SOC with Embedded LPDDR4x Memory
Snapdragon 835 system-on-chip with integrated LPDDR4x memory cache for flagship smartphones. While primarily a processor, significant memory function may classify under HTS 8542.32.00 if memory predominant.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If when processor function predominates
Standard classification for CPUs and microcontrollers.
If as part of complete mobile phones
ICs imported within finished telephones classify with the device.
If for other electrical machines incorporating the IC
Certain apparatus with ICs fall under 8543.
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Import Tips & Compliance
• Obtain binding ruling on principal function (memory vs processor); declare die size allocation to memory; comply with export controls on advanced nodes
Related Products under HTS 8542.32.00
Samsung K4B2G1646G-BCK0 8Gb DDR3L SDRAM Chip
This is a monolithic electronic integrated circuit memory chip using DDR3L SDRAM technology for high-speed data access in computers and servers. It falls under HTS 8542.32.00 as it is specifically classified as a memory integrated circuit, distinct from processors or other IC types.
Micron MT40A512M16HA-083E 8GB DDR4 SDRAM IC
A high-performance DDR4 synchronous dynamic random access memory integrated circuit used in laptops and data centers for temporary data storage. Classified under HTS 8542.32.00 as a dedicated memory IC with volatile storage capabilities.
Kingston EMMC 64GB NAND Flash Memory Chip
Embedded MultiMediaCard (eMMC) using 3D NAND flash technology for non-volatile storage in smartphones and tablets. HTS 8542.32.00 applies to this memory-specific integrated circuit before module assembly.
Intel 64GB Optane 3D XPoint Memory IC
Next-generation non-volatile memory integrated circuit using 3D XPoint technology for persistent storage with DRAM-like speeds in enterprise servers. Falls under HTS 8542.32.00 as a specialized memory IC.
SK Hynix H9HCNNNBDMMMR 16Gb LPDDR4X DRAM Chip
Low-power DDR4X synchronous DRAM IC optimized for mobile devices and automotive applications requiring efficient volatile memory. Classified in HTS 8542.32.00 for memory integrated circuits.
Western Digital 128GB 3D TLC NAND Flash IC
Triple-level cell 3D NAND flash memory die for high-capacity non-volatile storage in SSDs and embedded systems. HTS 8542.32.00 covers this as a memory-specific electronic integrated circuit.