MEMS Sensor Die Carriers

Carriers for transporting and processing MEMS (micro-electro-mechanical systems) semiconductor dies before packaging. Parts under 8541.90 for MEMS device fabrication.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFree+50.0%50%
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡¨πŸ‡¦CanadaFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

3923.10Lower: 13% vs 50%

If plastic containers

General plastic articles use 3923.

8486.90.00.00Lower: 25% vs 50%

If semiconductor machines

Production machine parts under 8486.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

β€’ MEMS device type and process stage documentation

β€’ Cleanroom compatibility certification

β€’ Die size and orientation specifications

Related Products under HTS 8541.90.00.80

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Photovoltaic Cell Test Probes

Precision probes used to test electrical characteristics of individual photovoltaic (solar) cells during quality control. Classified as parts of photosensitive semiconductor devices under 8541.90 for their dedicated testing role in solar cell production.

Transistor Heat Sinks

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Piezoelectric Crystal Holders

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Semiconductor Lead Frames

Copper alloy frames that hold semiconductor dice during wire bonding and packaging. Essential parts under 8541.90 for creating packaged semiconductor devices like ICs and transistors.