MEMS Sensor Die Carriers from China
Carriers for transporting and processing MEMS (micro-electro-mechanical systems) semiconductor dies before packaging. Parts under 8541.90 for MEMS device fabrication.
Duty Rate — China → United States
50%
Rate breakdown
9903.91.0550%Effective with respect to entries on or after January 1, 2025, articles the product of China, as provided for in subdivision (f) of U.S. note 31 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• MEMS device type and process stage documentation
• Cleanroom compatibility certification
• Die size and orientation specifications