Beam Lead Microwave Diode
Gold beam lead Schottky diode chips for hybrid microwave circuits in phased array radars. HTS 8541.10.00.60 for unpackaged microwave diode die with >40 GHz cutoff frequency. Enables high-density MMIC assembly.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If unmounted die form
Raw semiconductor die without specific microwave assembly fall under parts.
If flip-chip bonded to carrier
Beam lead diodes become monolithic ICs when permanently assembled.
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Import Tips & Compliance
• Wafer/die handling ESD precautions documented for cleanroom import protocols
• Chip size and beam lead pitch specifications for hybrid circuit verification
• Anti-static wafer shippers mandatory for microwave semiconductor dies
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