Multilayer Glass Epoxy Printed Circuit Board for Servers
A rigid printed circuit board with a base of plastics impregnated glass fabric (FR-4) featuring 4 layers of copper conducting materials for high-density server motherboard applications. It falls under HTS 8534.00.00.20 due to its non-flexible construction, glass-impregnated base, and 3+ conductive layers as per chapter specifications. These boards enable complex routing for data centers.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If constructed to be flexible or foldable
Flexible PCBs with impregnated glass base but designed for bending fall under the flexible subcategory, changing the tariff rate.
If imported as processors/memory with the PCB assembled
When the PCB is populated with electronic integrated circuits like CPUs, it classifies as a complete electronic module under processors/memory heading.
If imported as part of computer subassemblies for data processing
PCBs specifically for computers with 3+ layers may shift to computer parts heading if end-use is proven as data processing equipment.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Verify layer count and glass impregnation via cross-section analysis to confirm 8534.00.00.20 classification; misclassification risks penalties
• Include IPC-6012 certification and material datasheets in documentation to prove non-flexible, multi-layer status
• Avoid common pitfall of declaring as flexible PCBs (8534.00.0025) which have different rates; test for rigidity
Related Products under HTS 8534.00.00.20
4-Layer Power Distribution PCB for Telecom Base Stations
Multilayer PCB with thick copper layers on glass-reinforced epoxy for high-current power distribution in 5G base stations. HTS 8534.00.00.20 applies due to rigid form, impregnated glass base, and 4 conductive layers handling RF power. Supports wireless infrastructure.
Glass Epoxy Backplane PCB for Storage Arrays
High-layer backplane PCB with orthogonal connectors on glass-impregnated base for enterprise NAS/SAN storage systems. HTS 8534.00.00.20 for 8+ conductor layers in rigid format supporting SAS/SATA. Enables data center storage scalability.
8-Layer FR-4 Multilayer PCB for Networking Routers
High-layer-count printed circuit board using glass fiber reinforced epoxy resin base with 8 copper layers for advanced router signal processing. Classified under HTS 8534.00.00.20 for its rigid structure, impregnated glass base, and multiple conductive layers supporting high-speed data transmission. Essential for enterprise networking hardware.
6-Layer Glass Base PCB for Industrial Control Systems
Rigid multilayer circuit board with glass-impregnated plastic base and 6 layers of etched copper conductors for PLC and automation controllers. Meets HTS 8534.00.00.20 criteria with its non-flexible design and multi-layer construction for reliable industrial signaling. Used in manufacturing automation.
12-Layer High-Density Interconnect PCB for AI Accelerators
Advanced HDI printed circuit with 12 layers of fine-line copper on glass epoxy base for GPU/TPU accelerator cards in AI computing. Qualifies for HTS 8534.00.00.20 as a non-flexible, glass-impregnated multi-layer board enabling microvia technology. Critical for machine learning hardware.
10-Layer Rigid Multilayer PCB for Medical Imaging Devices
High-reliability 10-layer glass epoxy PCB for CT/MRI scanner control boards, featuring precise impedance control. Falls under HTS 8534.00.00.20 for its non-flexible, wholly glass-impregnated base with multiple conductor layers. Meets stringent medical electronics requirements.