8534.00.00.20/Multilayer Glass Epoxy Printed Circuit Board for Servers/Japan

Multilayer Glass Epoxy Printed Circuit Board for Servers from Japan

A rigid printed circuit board with a base of plastics impregnated glass fabric (FR-4) featuring 4 layers of copper conducting materials for high-density server motherboard applications. It falls under HTS 8534.00.00.20 due to its non-flexible construction, glass-impregnated base, and 3+ conductive layers as per chapter specifications. These boards enable complex routing for data centers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Verify layer count and glass impregnation via cross-section analysis to confirm 8534.00.00.20 classification; misclassification risks penalties

• Include IPC-6012 certification and material datasheets in documentation to prove non-flexible, multi-layer status

• Avoid common pitfall of declaring as flexible PCBs (8534.00.0025) which have different rates; test for rigidity