With 3 or more layers of conducting materials
Printed circuits > Plastics impregnated, not flexible type: > Having a base wholly of impregnated glass: > With 3 or more layers of conducting materials
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8534.00.00.20
Multilayer Glass Epoxy Printed Circuit Board for Servers
A rigid printed circuit board with a base of plastics impregnated glass fabric (FR-4) featuring 4 layers of copper conducting materials for high-density server motherboard applications. It falls under HTS 8534.00.00.20 due to its non-flexible construction, glass-impregnated base, and 3+ conductive layers as per chapter specifications. These boards enable complex routing for data centers.
4-Layer Power Distribution PCB for Telecom Base Stations
Multilayer PCB with thick copper layers on glass-reinforced epoxy for high-current power distribution in 5G base stations. HTS 8534.00.00.20 applies due to rigid form, impregnated glass base, and 4 conductive layers handling RF power. Supports wireless infrastructure.
Glass Epoxy Backplane PCB for Storage Arrays
High-layer backplane PCB with orthogonal connectors on glass-impregnated base for enterprise NAS/SAN storage systems. HTS 8534.00.00.20 for 8+ conductor layers in rigid format supporting SAS/SATA. Enables data center storage scalability.
8-Layer FR-4 Multilayer PCB for Networking Routers
High-layer-count printed circuit board using glass fiber reinforced epoxy resin base with 8 copper layers for advanced router signal processing. Classified under HTS 8534.00.00.20 for its rigid structure, impregnated glass base, and multiple conductive layers supporting high-speed data transmission. Essential for enterprise networking hardware.
6-Layer Glass Base PCB for Industrial Control Systems
Rigid multilayer circuit board with glass-impregnated plastic base and 6 layers of etched copper conductors for PLC and automation controllers. Meets HTS 8534.00.00.20 criteria with its non-flexible design and multi-layer construction for reliable industrial signaling. Used in manufacturing automation.
12-Layer High-Density Interconnect PCB for AI Accelerators
Advanced HDI printed circuit with 12 layers of fine-line copper on glass epoxy base for GPU/TPU accelerator cards in AI computing. Qualifies for HTS 8534.00.00.20 as a non-flexible, glass-impregnated multi-layer board enabling microvia technology. Critical for machine learning hardware.
10-Layer Rigid Multilayer PCB for Medical Imaging Devices
High-reliability 10-layer glass epoxy PCB for CT/MRI scanner control boards, featuring precise impedance control. Falls under HTS 8534.00.00.20 for its non-flexible, wholly glass-impregnated base with multiple conductor layers. Meets stringent medical electronics requirements.
Multilayer Glass PCB for Automotive ECU Modules
6-layer automotive-grade PCB with glass fabric epoxy base for engine control units, supporting CAN bus and sensors. HTS 8534.00.00.20 classification for rigid, multi-conductor layer design with vibration resistance. Key for vehicle electronics.
High-Frequency 8-Layer PCB for Radar Systems
RF-optimized 8-layer PCB using low-loss glass epoxy laminate for phased-array radar processing with controlled impedance traces. Meets HTS 8534.00.00.20 with glass-impregnated rigid base and multiple conductor layers. Used in defense and aviation radar.
16-Layer Server Motherboard Core PCB
Complex 16-layer glass fabric PCB forming the backbone for enterprise server motherboards with DDR5 routing. HTS 8534.00.00.20 due to non-flexible, wholly impregnated glass base with extensive conductive layers. Powers cloud computing infrastructure.
5-Layer Mixed-Signal PCB for Audio Processors
Multilayer PCB with analog/digital layer separation on glass epoxy for professional audio mixing consoles. Classified HTS 8534.00.00.20 for rigid glass base and 5 copper layers handling mixed signals. Used in studio recording equipment.
7-Layer Control PCB for Robotics Arms
Robust 7-layer glass base PCB for industrial robot controller cards with real-time processing layers. Fits HTS 8534.00.00.20 with impregnated glass rigidity and multi-conductor design for servo control. Powers automation robotics.
Multilayer Test Fixture PCB for Electronics Manufacturing
Custom 4-layer glass epoxy PCB used as bed-of-nails test fixture for circuit board validation. HTS 8534.00.00.20 applies to its rigid glass base and multiple conductive layers with probe points. Essential for PCB assembly quality control.
9-Layer RF Front-End PCB for 5G Smartphones
Compact 9-layer HDI PCB with glass microcloth base for smartphone RF modules handling mmWave signals. Classified under HTS 8534.00.00.20 for non-flexible glass impregnation and dense conductor layers. Critical for mobile connectivity.
Glass Base Multilayer PCB for Drone Flight Controllers
Lightweight 6-layer glass epoxy PCB for UAV flight control with IMU/GPS integration layers. HTS 8534.00.00.20 for rigid, impregnated glass base and multi-layer conductors supporting autonomous flight. Used in commercial drones.