High-Frequency 8-Layer PCB for Radar Systems
RF-optimized 8-layer PCB using low-loss glass epoxy laminate for phased-array radar processing with controlled impedance traces. Meets HTS 8534.00.00.20 with glass-impregnated rigid base and multiple conductor layers. Used in defense and aviation radar.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If radio navigational aid apparatus components
PCBs for radar nav systems classify under complete radio apparatus heading.
If parts for radar electrical equipment
Assembled radar modules shift classification from bare PCBs.
If flexible high-frequency construction
Flex versions for conformal radar apps use different subheading.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
• Include dielectric constant (Dk) specs and layer stackup to prove high-freq multi-layer design
• For defense apps, prepare export license equivalents and end-user statements
Related Products under HTS 8534.00.00.20
Multilayer Glass Epoxy Printed Circuit Board for Servers
A rigid printed circuit board with a base of plastics impregnated glass fabric (FR-4) featuring 4 layers of copper conducting materials for high-density server motherboard applications. It falls under HTS 8534.00.00.20 due to its non-flexible construction, glass-impregnated base, and 3+ conductive layers as per chapter specifications. These boards enable complex routing for data centers.
4-Layer Power Distribution PCB for Telecom Base Stations
Multilayer PCB with thick copper layers on glass-reinforced epoxy for high-current power distribution in 5G base stations. HTS 8534.00.00.20 applies due to rigid form, impregnated glass base, and 4 conductive layers handling RF power. Supports wireless infrastructure.
Glass Epoxy Backplane PCB for Storage Arrays
High-layer backplane PCB with orthogonal connectors on glass-impregnated base for enterprise NAS/SAN storage systems. HTS 8534.00.00.20 for 8+ conductor layers in rigid format supporting SAS/SATA. Enables data center storage scalability.
8-Layer FR-4 Multilayer PCB for Networking Routers
High-layer-count printed circuit board using glass fiber reinforced epoxy resin base with 8 copper layers for advanced router signal processing. Classified under HTS 8534.00.00.20 for its rigid structure, impregnated glass base, and multiple conductive layers supporting high-speed data transmission. Essential for enterprise networking hardware.
6-Layer Glass Base PCB for Industrial Control Systems
Rigid multilayer circuit board with glass-impregnated plastic base and 6 layers of etched copper conductors for PLC and automation controllers. Meets HTS 8534.00.00.20 criteria with its non-flexible design and multi-layer construction for reliable industrial signaling. Used in manufacturing automation.
12-Layer High-Density Interconnect PCB for AI Accelerators
Advanced HDI printed circuit with 12 layers of fine-line copper on glass epoxy base for GPU/TPU accelerator cards in AI computing. Qualifies for HTS 8534.00.00.20 as a non-flexible, glass-impregnated multi-layer board enabling microvia technology. Critical for machine learning hardware.