Multilayer Glass Epoxy Printed Circuit Board for Servers from China

A rigid printed circuit board with a base of plastics impregnated glass fabric (FR-4) featuring 4 layers of copper conducting materials for high-density server motherboard applications. It falls under HTS 8534.00.00.20 due to its non-flexible construction, glass-impregnated base, and 3+ conductive layers as per chapter specifications. These boards enable complex routing for data centers.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)

Import Tips

Verify layer count and glass impregnation via cross-section analysis to confirm 8534.00.00.20 classification; misclassification risks penalties

Include IPC-6012 certification and material datasheets in documentation to prove non-flexible, multi-layer status

Avoid common pitfall of declaring as flexible PCBs (8534.00.0025) which have different rates; test for rigidity