Bluetooth Audio Module Assembly
This assembly consists of a printed circuit board with Bluetooth chipset, amplifier IC, and passive components fastened together, designed solely for use in wireless headphones of heading 8521. It enables wireless audio transmission and reception when integrated into the headphone apparatus. Classified under 8522.90.36.00 as an assembly of two or more pieces for subheading 8519.81.41 apparatus.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +35.0% | 35% |
| š²š½Mexico | Free | +10.0% | 10% |
| šØš¦Canada | Free | +10.0% | 10% |
| š©šŖGermany | Free | +10.0% | 10% |
| šÆšµJapan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If incorporating microphone elements
Assemblies with integrated microphones for voice transmission fall under heading 8518 for mic apparatus.
If used with other audio apparatus beyond 8519/8521
Broader compatibility with non-heading 8519/8521 audio equipment moves it to general parts subheading.
If imported as individual processors without assembly
Unassembled integrated circuits or single-piece boards classify as electronic ICs, not multi-part assemblies.
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Import Tips & Compliance
ā¢ Verify the assembly is exclusively for 8519.81.41 apparatus via technical specs and end-use declaration to avoid reclassification
ā¢ Include detailed BOM and assembly diagrams in documentation to prove multi-piece construction
Related Products under HTS 8522.90.36.00
True Wireless Earbud Driver Assembly
Pre-assembled unit combining dynamic driver, acoustic chamber, and mounting frame fastened together for true wireless stereo earbuds under 8519.81.41. This subassembly handles sound reproduction and vibration isolation. Fits 8522.90.36.00 as a multi-piece assembly for specific headphone apparatus.
Bluetooth Antenna Flex Assembly
Flexible PCB antenna assembly with ceramic chip, matching circuit, and adhesive mount fastened for TWS earbuds (8519.81.41). Optimizes 2.4GHz Bluetooth signal. 8522.90.36.00 multi-piece for wireless headphones.
TWS Battery Compartment Subassembly
Assembled module with lithium-polymer battery, protective circuit, and metal chassis fastened for TWS earbuds (8519.81.41). Provides power management and safety features. Qualifies under 8522.90.36.00 for multi-part assemblies dedicated to wireless headphones.
ANC Microphone Array Assembly
Multi-mic assembly with MEMS microphones, signal processing PCB, and acoustic ports joined for active noise cancellation in wireless headphones (8519.81.41). Captures ambient noise for cancellation algorithms. 8522.90.36.00 due to multi-piece construction for specified apparatus.
Headphone Armature Driver Subassembly
Balanced armature driver assembly with multiple armatures, diaphragm, and housing fastened for high-fidelity wireless headphones under 8519.81.41. Delivers precise audio reproduction. Meets 8522.90.36.00 as dedicated multi-part subassembly.
Wireless Headphone PCB Mainboard Assembly
Main PCB assembly with SoC, memory, RF module, and connectors soldered together for Bluetooth headphones (8519.81.41). Serves as the core processing unit. 8522.90.36.00 classification for fastened multi-part construction.