Bluetooth Audio Module Assembly from Japan
This assembly consists of a printed circuit board with Bluetooth chipset, amplifier IC, and passive components fastened together, designed solely for use in wireless headphones of heading 8521. It enables wireless audio transmission and reception when integrated into the headphone apparatus. Classified under 8522.90.36.00 as an assembly of two or more pieces for subheading 8519.81.41 apparatus.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify the assembly is exclusively for 8519.81.41 apparatus via technical specs and end-use declaration to avoid reclassification
• Include detailed BOM and assembly diagrams in documentation to prove multi-piece construction