ANC Microphone Array Assembly
Multi-mic assembly with MEMS microphones, signal processing PCB, and acoustic ports joined for active noise cancellation in wireless headphones (8519.81.41). Captures ambient noise for cancellation algorithms. 8522.90.36.00 due to multi-piece construction for specified apparatus.
Import Duty Rates by Country of Origin
| Origin Country | MFN Rate | Ch.99 Surcharges | Total Effective Rate |
|---|---|---|---|
| šØš³China | Free | +35.0% | 35% |
| š²š½Mexico | Free | +10.0% | 10% |
| šØš¦Canada | Free | +10.0% | 10% |
| š©šŖGermany | Free | +10.0% | 10% |
| šÆšµJapan | Free | +10.0% | 10% |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily microphone function
Mic-centric assemblies classify under heading 8518 microphones.
If other integrated circuits dominant
Signal processors without mic mounting classify as other IC apparatus.
If for transmission apparatus parts
If focused on radio transmission mics, shifts to 8525 subheading parts.
Not sure which classification is right?
Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.
Import Tips & Compliance
ā¢ Document frequency response specs proving headphone integration suitability
ā¢ Use HTS ruling requests for complex ANC assemblies to confirm classification
Related Products under HTS 8522.90.36.00
True Wireless Earbud Driver Assembly
Pre-assembled unit combining dynamic driver, acoustic chamber, and mounting frame fastened together for true wireless stereo earbuds under 8519.81.41. This subassembly handles sound reproduction and vibration isolation. Fits 8522.90.36.00 as a multi-piece assembly for specific headphone apparatus.
Bluetooth Antenna Flex Assembly
Flexible PCB antenna assembly with ceramic chip, matching circuit, and adhesive mount fastened for TWS earbuds (8519.81.41). Optimizes 2.4GHz Bluetooth signal. 8522.90.36.00 multi-piece for wireless headphones.
Bluetooth Audio Module Assembly
This assembly consists of a printed circuit board with Bluetooth chipset, amplifier IC, and passive components fastened together, designed solely for use in wireless headphones of heading 8521. It enables wireless audio transmission and reception when integrated into the headphone apparatus. Classified under 8522.90.36.00 as an assembly of two or more pieces for subheading 8519.81.41 apparatus.
TWS Battery Compartment Subassembly
Assembled module with lithium-polymer battery, protective circuit, and metal chassis fastened for TWS earbuds (8519.81.41). Provides power management and safety features. Qualifies under 8522.90.36.00 for multi-part assemblies dedicated to wireless headphones.
Headphone Armature Driver Subassembly
Balanced armature driver assembly with multiple armatures, diaphragm, and housing fastened for high-fidelity wireless headphones under 8519.81.41. Delivers precise audio reproduction. Meets 8522.90.36.00 as dedicated multi-part subassembly.
Wireless Headphone PCB Mainboard Assembly
Main PCB assembly with SoC, memory, RF module, and connectors soldered together for Bluetooth headphones (8519.81.41). Serves as the core processing unit. 8522.90.36.00 classification for fastened multi-part construction.