Bluetooth Audio Module Assembly from Canada
This assembly consists of a printed circuit board with Bluetooth chipset, amplifier IC, and passive components fastened together, designed solely for use in wireless headphones of heading 8521. It enables wireless audio transmission and reception when integrated into the headphone apparatus. Classified under 8522.90.36.00 as an assembly of two or more pieces for subheading 8519.81.41 apparatus.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify the assembly is exclusively for 8519.81.41 apparatus via technical specs and end-use declaration to avoid reclassification
• Include detailed BOM and assembly diagrams in documentation to prove multi-piece construction