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Worm Gear for Wafer Lapping Machine

Precision worm gear providing slow, high-torque rotation for wafer lappers that achieve sub-micron flatness on semiconductor wafer surfaces before fabrication. Covered under statistical note wafer grinders, lappers, and polishers.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2.8%+50.0%52.8%
🇲🇽Mexico2.8%+25.0%27.8%
🇨🇦Canada2.8%+25.0%27.8%
🇩🇪Germany2.8%+25.0%27.8%
🇯🇵Japan2.8%+25.0%27.8%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8484.20.00Lower: 41.4% vs 52.8%

If lapping equipment for general optics

Non-semiconductor lapping/policing machines classify under static converters.

9018.90.80Lower: 12.5% vs 52.8%

If medical/optical wafer processing

Precision lapping for optical components falls under instruments.

8479.82.00Lower: 37.5% vs 52.8%

If other semiconductor processing machines

Complete lapping machines may classify under unlisted semiconductor equipment.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Specify flatness specs (lambda/10 or better) to validate semiconductor wafer application

• Provide slurry compatibility data for lapping process documentation