Parts of articles of subheading 8483.60.80
Transmission shafts (including camshafts and crankshafts) and cranks; bearing housings, housed bearings and plain shaft bearings; gears and gearing; ball or roller screws; gear boxes and other speed changers, including torque converters; flywheels and pulleys, including pulley blocks; clutches and shaft couplings (including universal joints); parts thereof: > Toothed wheels, chain sprockets and other transmission elements presented separately; parts: > Other: > Other > Parts of articles of subheading 8483.60.80
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8483.90.80.10
Index Gear for Wafer Grinder Spindle
Multi-station indexing gear rotating wafer spindles through grinding, etching, and cleaning cycles in semiconductor wafer processing equipment.
Anti-Backlash Gear for Crystal Puller Lift
Zero-backlash precision gear eliminating play in vertical lift mechanism of semiconductor crystal pullers, ensuring constant growth speed.
Flexible Gear Coupling for Wafer Lapper Drive
Flexible gear coupling compensating for thermal expansion in high-speed wafer lapper drive trains, maintaining alignment during operation.
Timing Belt Pulley for Wafer Slicing Saw
Specialized timing pulley that drives the high-speed diamond blade in wafer slicing saws, which cut thin semiconductor wafers from monocrystalline boules. Critical transmission component for precise wafer thickness control in equipment of 8483.60.80.
Chain Sprocket for Wafer Polishing Equipment
Industrial chain sprocket driving the polishing pad carrier in double-side wafer polishers, achieving mirror-finish surfaces for semiconductor device fabrication. Essential transmission element per statistical note (a)(ii)(C).
Camshaft for Semiconductor Wafer Indexer
Custom camshaft controlling precise wafer indexing and rotation in automated semiconductor processing equipment under 8483.60.80. Ensures exact positioning for grinding/polishing operations.
Planetary Gear Set for Crystal Puller Rotation
Compact planetary gear reduction set providing high-torque, low-speed crucible rotation in Czochralski crystal pullers for uniform semiconductor boule growth.
Rack and Pinion for Wafer Grinding Head
Precision rack and pinion mechanism adjusting grinding head position in semiconductor wafer grinders, controlling backgrind thickness to microns.
Spline Shaft Coupling for Wafer Polisher
High-precision spline coupling connecting drive motor to polishing platen in semiconductor wafer polishers, transmitting torque without slippage.
Sector Gear for Boule Slicing Orientation
Partial arc sector gear indexing crystal boule orientation before slicing into wafers, ensuring proper crystal plane alignment.
Harmonic Drive Gear for Wafer Alignment
High-ratio harmonic drive providing sub-arcsecond wafer alignment in semiconductor processing equipment for precise flat and notch positioning.
Spur Gear for Semiconductor Wafer Crystal Puller
A precision-machined spur gear designed specifically for use in Czochralski crystal pullers, which produce monocrystalline silicon boules for semiconductor wafers. It transmits rotational motion in the pulling mechanism of equipment covered under HTS 8483.60.80. Classified as a part of toothed wheels and transmission elements for semiconductor manufacturing machinery.
Helical Gear for Float Zone Crystal Grower
High-precision helical gear utilized in float zone crystal growers for producing pure monocrystalline semiconductor boules from polycrystalline rods. Essential for precise speed control in the zone melting process of equipment under 8483.60.80. Meets statistical note for wafer manufacturing crystal growers.
Bevel Gear for Crystal Boule Grinder
Bevel gear system transferring power at 90-degree angles in crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Part of wafer preparation equipment per statistical note (a)(ii)(A).
Worm Gear for Wafer Lapping Machine
Precision worm gear providing slow, high-torque rotation for wafer lappers that achieve sub-micron flatness on semiconductor wafer surfaces before fabrication. Covered under statistical note wafer grinders, lappers, and polishers.