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Rack and Pinion for Wafer Grinding Head

Precision rack and pinion mechanism adjusting grinding head position in semiconductor wafer grinders, controlling backgrind thickness to microns.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2.8%+50.0%52.8%
🇲🇽Mexico2.8%+25.0%27.8%
🇨🇦Canada2.8%+25.0%27.8%
🇩🇪Germany2.8%+25.0%27.8%
🇯🇵Japan2.8%+25.0%27.8%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.29.01Lower: 41.9% vs 52.8%

If general grinding machine slides

Positioning mechanisms for non-semiconductor grinders.

9031.80.80Lower: 37.5% vs 52.8%

If measuring positioning systems

Integrated with wafer thickness measurement.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.

Import Tips & Compliance

• Thickness tolerance documentation (±1 micron typical) essential

• Anti-backlash design specs prove semiconductor precision