Rack and Pinion for Wafer Grinding Head from Japan
Precision rack and pinion mechanism adjusting grinding head position in semiconductor wafer grinders, controlling backgrind thickness to microns.
Duty Rate — Japan → United States
12.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Thickness tolerance documentation (±1 micron typical) essential
• Anti-backlash design specs prove semiconductor precision