Rack and Pinion for Wafer Grinding Head from Canada
Precision rack and pinion mechanism adjusting grinding head position in semiconductor wafer grinders, controlling backgrind thickness to microns.
Duty Rate — Canada → United States
27.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Thickness tolerance documentation (±1 micron typical) essential
• Anti-backlash design specs prove semiconductor precision