Worm Gear for Wafer Lapping Machine from Canada
Precision worm gear providing slow, high-torque rotation for wafer lappers that achieve sub-micron flatness on semiconductor wafer surfaces before fabrication. Covered under statistical note wafer grinders, lappers, and polishers.
Duty Rate — Canada → United States
27.8%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify flatness specs (lambda/10 or better) to validate semiconductor wafer application
• Provide slurry compatibility data for lapping process documentation