Hardened Steel Lap Bearing for Wafer Grinder

Precision-ground hardened steel plain shaft bearing without housing for lap platens in wafer grinders preparing semiconductor wafers for fabrication. HTS 8483.30.8090 applies to this plain shaft bearing in semiconductor processing tools.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.5%+35.0%39.5%
🇲🇽Mexico4.5%+10.0%14.5%
🇨🇦Canada4.5%+10.0%14.5%
🇩🇪Germany4.5%+10.0%14.5%
🇯🇵Japan4.5%+10.0%14.5%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7208.52.00.00Lower: 35% vs 39.5%

If hot-rolled steel not finished as bearing

Semi-finished steel products classify in Chapter 72.

8466.94Lower: 14.7% vs 39.5%

If part of machine tools for grinding

Wafer grinders as machine tools pull parts to Chapter 84 heading 8466.

8483.10.50.00Lower: 35% vs 39.5%

If crankshaft/transmission shaft application

Plain bearings for engines/vehicles shift within 8483 but different subheading.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Provide Rockwell hardness certs and grind flatness specs

Separate from housing to maintain 'without housing' status

Anti-dumping vigilance for steel products from certain origins

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