Hardened Steel Lap Bearing for Wafer Grinder from Germany
Precision-ground hardened steel plain shaft bearing without housing for lap platens in wafer grinders preparing semiconductor wafers for fabrication. HTS 8483.30.8090 applies to this plain shaft bearing in semiconductor processing tools.
Duty Rate — Germany → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide Rockwell hardness certs and grind flatness specs
• Separate from housing to maintain 'without housing' status
• Anti-dumping vigilance for steel products from certain origins