Hardened Steel Lap Bearing for Wafer Grinder from China
Precision-ground hardened steel plain shaft bearing without housing for lap platens in wafer grinders preparing semiconductor wafers for fabrication. HTS 8483.30.8090 applies to this plain shaft bearing in semiconductor processing tools.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Provide Rockwell hardness certs and grind flatness specs
• Separate from housing to maintain 'without housing' status
• Anti-dumping vigilance for steel products from certain origins