Hardened Steel Lap Bearing for Wafer Grinder from Japan
Precision-ground hardened steel plain shaft bearing without housing for lap platens in wafer grinders preparing semiconductor wafers for fabrication. HTS 8483.30.8090 applies to this plain shaft bearing in semiconductor processing tools.
Duty Rate — Japan → United States
29.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide Rockwell hardness certs and grind flatness specs
• Separate from housing to maintain 'without housing' status
• Anti-dumping vigilance for steel products from certain origins