Hardened Outer Bearing Ring for Wafer Slicing Saws
Chrome steel outer ring engineered for diamond wire wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Falls under 8482.99.2580 as other outer race for specialized precision bearings in semiconductor processing equipment. Provides critical radial support during high-precision slicing operations.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If made of bronze or copper alloys
Material composition determines specific subheading within inner/outer races.
If for parts of semiconductor wafer preparation machines
May classify as parts of specific wafer processing machinery under Chapter 84.
If supplied as complete thrust ball bearing assembly
Complete bearing assemblies classify differently from separate races.
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Import Tips & Compliance
• Provide evidence of diamond wire saw compatibility; include surface finish specifications (Ra < 0.1μm); declare as semiconductor processing equipment part to qualify for potential duty relief programs
Related Products under HTS 8482.99.25.80
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Precision-machined steel inner race designed for high-speed spindle bearings in Czochralski crystal pullers used to grow monocrystalline silicon boules. Classified under 8482.99.2580 as an other inner ring for specialized industrial bearings, distinct from standard automotive or machinery applications. Essential component ensuring rotational stability during semiconductor crystal growth process.
Ceramic Hybrid Inner Race for Wafer Grinder Spindles
Silicon nitride ceramic inner race paired with steel balls for high-speed wafer grinders that achieve dimensional tolerances on semiconductor wafers. Classified in 8482.99.2580 as other inner ring for semiconductor manufacturing bearings requiring extreme flatness and wear resistance. Used in back-grinding processes for wafer thinning.
Precision Steel Race for Crystal Boule Grinders
Through-hardened steel race for grinders that shape semiconductor crystal boules to exact diameters before wafer slicing. HTS 8482.99.2580 classification for other bearing races used in semiconductor boule preparation equipment. Critical for maintaining crystal orientation flats indicating conductivity type.
High-Speed Outer Race for Wafer Lapping Machines
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