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Ball or roller bearings, and parts thereof: > Parts: > Other: > Inner or outer rings or races: > Other

Duty Rate (from China)

40.8%
MFN Base Rate5.8%

Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Total Effective Rate40.8%

Products classified under HTS 8482.99.25

Stainless Steel Outer Bearing Race for Semiconductor Wafer Slicers

Precision-machined stainless steel outer race designed for high-speed ball bearings in wafer slicing saws used in semiconductor manufacturing. It provides the rolling surface for balls in bearings that support the saw blade during thin wafer cuts from silicon boules. Classified under 8482.99.25 as an other inner or outer ring or race for specialized industrial applications.

Hardened Steel Inner Ring for Crystal Puller Bearings

High-hardness alloy steel inner ring for thrust ball bearings in Czochralski crystal pullers, enabling rotation of the seed crystal during monocrystalline silicon boule growth. Essential for maintaining precise speeds under extreme thermal conditions in semiconductor material production. Falls under 8482.99.25 as an other bearing ring not specified elsewhere.

Ceramic-Coated Outer Race for Wafer Grinder Spindles

Advanced ceramic-coated steel outer race for angular contact ball bearings in wafer grinders, ensuring minimal particle generation during crystal boule diameter grinding. Critical for achieving precise flats indicating conductivity type in semiconductor wafers. HTS 8482.99.25 covers such specialized other bearing races.

Titanium Alloy Outer Ring for Float Zone Crystal Growers

Lightweight titanium alloy outer ring for radial bearings in float zone crystal growers, resisting high temperatures during polysilicon rod zone melting for ultra-pure semiconductor material. Enables stable rotation for defect-free boule formation. HTS 8482.99.25 for other specialized bearing races.

Carbide-Enhanced Inner Race for Wafer Slicing Spindles

Tungsten carbide insert inner race for diamond wafer slicing saw bearings, providing extreme wear resistance during continuous silicon wafer production. Maintains spindle precision for uniform wafer thickness. Under 8482.99.25 as other bearing rings.

High-Temp Outer Race for Czochralski Puller Thrust Bearings

Inconel superalloy outer race for thrust bearings in Czochralski pullers, enduring 1400°C+ melt temperatures during silicon crystal growth. Supports vertical pull mechanism for large-diameter semiconductor boules. 8482.99.25 classification for other races.

Nano-Polished Inner Ring for Semiconductor Wafer Lappers

Nano-surface finished inner ring for air-bearing spindles in wafer lappers, achieving sub-micron flatness for semiconductor device fabrication readiness. Minimizes subsurface damage in lapping process. HTS 8482.99.25 for precision other bearing rings.

Vacuum-Compatible Inner Race for Wafer Processing Bearings

Non-outgassing alloy inner race for UHV bearings in vacuum wafer processing equipment like crystal pullers and grinders. Maintains performance in 10^-9 Torr environments for contamination-free semiconductor production. 8482.99.25 for other races.

Precision Ground Inner Race for Wafer Polishing Bearings

Ultra-precision ground inner race for hydrostatic bearings in wafer lappers and polishers, delivering mirror-flat surfaces required for semiconductor fabrication. Supports high-RPM polishing heads while maintaining nanometer-level tolerances. Classified in 8482.99.25 as other bearing rings for specialized machinery.

Custom Alloy Outer Race for Crystal Grinder Flattening

Custom low-expansion alloy outer race for precision bearings in crystal grinders that create flats on semiconductor boules for resistivity indication. Ensures angular accuracy during grinding operations. Classified 8482.99.25 as other specialized race.