Precision Ground Inner Race for Wafer Polishing Bearings
Ultra-precision ground inner race for hydrostatic bearings in wafer lappers and polishers, delivering mirror-flat surfaces required for semiconductor fabrication. Supports high-RPM polishing heads while maintaining nanometer-level tolerances. Classified in 8482.99.25 as other bearing rings for specialized machinery.
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More Specific Codes
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for plain shaft/bearing housings
If designed as slide bearing components rather than rolling element races, shifts to 8483.
If imported with wafer polishers
Parts of semiconductor wafer processing machines like polishers go to 8479 machine parts.
If specifically ball or roller bearing use
Narrower ball/roller designation applies over 'other' for matching applications.
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Import Tips & Compliance
• Submit surface finish measurements (Ra values) and tolerance specs in entry docs for proper valuation
• Reference statistical notes for semiconductor wafer prep equipment to support classification
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