Precision Ground Inner Race for Wafer Polishing Bearings from Japan
Ultra-precision ground inner race for hydrostatic bearings in wafer lappers and polishers, delivering mirror-flat surfaces required for semiconductor fabrication. Supports high-RPM polishing heads while maintaining nanometer-level tolerances. Classified in 8482.99.25 as other bearing rings for specialized machinery.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit surface finish measurements (Ra values) and tolerance specs in entry docs for proper valuation
• Reference statistical notes for semiconductor wafer prep equipment to support classification