Hardened Outer Bearing Ring for Wafer Slicing Saws from Japan
Chrome steel outer ring engineered for diamond wire wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Falls under 8482.99.2580 as other outer race for specialized precision bearings in semiconductor processing equipment. Provides critical radial support during high-precision slicing operations.
Duty Rate — Japan → United States
15.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide evidence of diamond wire saw compatibility; include surface finish specifications (Ra < 0.1μm); declare as semiconductor processing equipment part to qualify for potential duty relief programs