Precision Steel Race for Crystal Boule Grinders
Through-hardened steel race for grinders that shape semiconductor crystal boules to exact diameters before wafer slicing. HTS 8482.99.2580 classification for other bearing races used in semiconductor boule preparation equipment. Critical for maintaining crystal orientation flats indicating conductivity type.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If designed for cylindrical roller bearings
Roller bearing races classified separately from ball bearing races.
If considered interchangeable tooling
Interchangeable grinding tools sometimes classify as tooling rather than bearings.
If for semiconductor metrology equipment
Precision measurement apparatus parts fall under Chapter 90.
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Import Tips & Compliance
• Document boule grinder OEM specifications; include flatness tolerance data (≤0.5μm); segregate from general machinery races to avoid incorrect Chapter 84 headings
Related Products under HTS 8482.99.25.80
Steel Inner Bearing Race for Semiconductor Wafer Pullers
Precision-machined steel inner race designed for high-speed spindle bearings in Czochralski crystal pullers used to grow monocrystalline silicon boules. Classified under 8482.99.2580 as an other inner ring for specialized industrial bearings, distinct from standard automotive or machinery applications. Essential component ensuring rotational stability during semiconductor crystal growth process.
Hardened Outer Bearing Ring for Wafer Slicing Saws
Chrome steel outer ring engineered for diamond wire wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Falls under 8482.99.2580 as other outer race for specialized precision bearings in semiconductor processing equipment. Provides critical radial support during high-precision slicing operations.
Ceramic Hybrid Inner Race for Wafer Grinder Spindles
Silicon nitride ceramic inner race paired with steel balls for high-speed wafer grinders that achieve dimensional tolerances on semiconductor wafers. Classified in 8482.99.2580 as other inner ring for semiconductor manufacturing bearings requiring extreme flatness and wear resistance. Used in back-grinding processes for wafer thinning.
High-Speed Outer Race for Wafer Lapping Machines
Special alloy steel outer race for lapping machines that polish semiconductor wafers to mirror finish before device fabrication. 8482.99.2580 as other outer ring for semiconductor wafer preparation bearings operating at 3000+ RPM. Ensures uniform material removal across 300mm wafers.
Tapered Roller Race for Float Zone Crystal Pullers
Tapered roller bearing race for float zone crystal growers producing ultra-pure silicon for power semiconductors. Classified 8482.99.2580 as other race for specialized semiconductor manufacturing equipment bearings. Supports vertical axis during RF heating zone travel.