Self-Operating Pressure Valve for Wafer Grinder Coolant Feed

Maintains constant pressure in coolant lines feeding wafer back-grinders for thickness reduction. HTS 8481.80.9015 classification for pressure regulation in semiconductor wafer grinding equipment. Ensures uniform grinding across 300mm wafer surfaces.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China2%+35.0%37%
🇲🇽Mexico2%+10.0%12%
🇨🇦Canada2%+10.0%12%
🇩🇪Germany2%+10.0%12%
🇯🇵Japan2%+10.0%12%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8481.20.00Same rate: 37%

If valves for hydraulic/pneumatic transmission

Different application (power transmission vs process control) changes classification.

8466.94.85Higher: 39.7% vs 37%

If specific to semiconductor grinding machines

Parts of wafer processing machinery take machine-specific part provisions.

9026.20Lower: 10% vs 37%

If pressure control with manometer integration

Instruments for pressure control/regulation classify in Chapter 90.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include pressure regulation specs (e.g

2-6 bar) matching wafer grinder requirements

Verify cleanroom particle generation ratings (≤ Class 1)

Avoid classification as hydraulic components under 8412.90

Related Products under HTS 8481.80.90.15

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