Self-Operating Pressure Valve for Wafer Grinder Coolant Feed from Mexico
Maintains constant pressure in coolant lines feeding wafer back-grinders for thickness reduction. HTS 8481.80.9015 classification for pressure regulation in semiconductor wafer grinding equipment. Ensures uniform grinding across 300mm wafer surfaces.
Duty Rate — Mexico → United States
12%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include pressure regulation specs (e.g
• 2-6 bar) matching wafer grinder requirements
• Verify cleanroom particle generation ratings (≤ Class 1)
• Avoid classification as hydraulic components under 8412.90