Self-Operating Pressure Valve for Wafer Grinder Coolant Feed from Japan
Maintains constant pressure in coolant lines feeding wafer back-grinders for thickness reduction. HTS 8481.80.9015 classification for pressure regulation in semiconductor wafer grinding equipment. Ensures uniform grinding across 300mm wafer surfaces.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include pressure regulation specs (e.g
• 2-6 bar) matching wafer grinder requirements
• Verify cleanroom particle generation ratings (≤ Class 1)
• Avoid classification as hydraulic components under 8412.90