Self-Operating Pressure Valve for Wafer Grinder Coolant Feed from China
Maintains constant pressure in coolant lines feeding wafer back-grinders for thickness reduction. HTS 8481.80.9015 classification for pressure regulation in semiconductor wafer grinding equipment. Ensures uniform grinding across 300mm wafer surfaces.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include pressure regulation specs (e.g
• 2-6 bar) matching wafer grinder requirements
• Verify cleanroom particle generation ratings (≤ Class 1)
• Avoid classification as hydraulic components under 8412.90