Crystal Boule Grinder
Precision grinding machine with self-contained electric motor that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity and resistivity. Prepares boules for wafer slicing in semiconductor fabrication workflow. HTS 8479.89.65.00 covers this wafer preparation electromechanical appliance.
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Import Tips & Compliance
• Document tolerance specifications (micron-level) to prove semiconductor precision requirements
• Separate diamond grinding wheels if imported unmounted to use lower duty tools provisions
• Conduct country-of-origin analysis for motor components affecting final classification
Related Products under HTS 8479.89.65.00
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by pulling a seed crystal from molten silicon in the Czochralski process, essential for semiconductor wafer manufacturing. It features a self-contained electric motor for precise control of rotation and pulling mechanisms. Classified under HTS 8479.89.65.00 as an electromechanical appliance with self-contained electric motor for semiconductor processing not specified elsewhere.
Float Zone Crystal Grower
Electromechanical apparatus employing the float zone method to produce high-purity monocrystalline silicon rods by melting and recrystallizing a polycrystalline rod using RF heating and motorized zone travel. Critical for semiconductor wafer production with self-contained motors for precise positioning. Falls under HTS 8479.89.65.00 as other semiconductor manufacturing equipment with electric motor.
Wafer Slicing Diamond Saw
High-precision inner-diameter saw with self-contained motor and diamond blade for slicing ultra-thin semiconductor wafers from monocrystalline boules while maintaining crystal orientation. Uses coolant systems and automated feed for minimal kerf loss. Classified in HTS 8479.89.65.00 as essential wafer manufacturing apparatus.
Semiconductor Wafer Lapper
Electromechanical lapping machine with self-contained motor that uses loose abrasive slurry on cast iron plates to achieve sub-micron flatness on semiconductor wafer surfaces prior to polishing. Critical for bringing wafers within tight dimensional tolerances. HTS 8479.89.65.00 for wafer preparation equipment.
Double-Sided Wafer Polisher
Automated polishing machine with self-contained electric motors that simultaneously polishes both sides of semiconductor wafers using polyurethane pads and colloidal silica slurry to achieve mirror finish and extreme flatness. Prepares wafers for device fabrication. Falls under HTS 8479.89.65.00 per statistical note.
Crystal Diameter Grinder
Motorized grinding apparatus that precisely reduces semiconductor boule diameter to standard wafer sizes (150mm, 200mm, 300mm) while maintaining cylindrical geometry. Includes automated measurement feedback. HTS 8479.89.65.00 for boule preparation equipment.