Crystal Boule Grinder from Japan
Precision grinding machine with self-contained electric motor that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity and resistivity. Prepares boules for wafer slicing in semiconductor fabrication workflow. HTS 8479.89.65.00 covers this wafer preparation electromechanical appliance.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Section 232: ag equipment + residential HVAC, MFN<15% — 15% ceiling (Annex III addition)
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document tolerance specifications (micron-level) to prove semiconductor precision requirements
• Separate diamond grinding wheels if imported unmounted to use lower duty tools provisions
• Conduct country-of-origin analysis for motor components affecting final classification