Crystal Boule Grinder from China
Precision grinding machine with self-contained electric motor that shapes semiconductor crystal boules to exact wafer diameters and grinds orientation flats indicating conductivity and resistivity. Prepares boules for wafer slicing in semiconductor fabrication workflow. HTS 8479.89.65.00 covers this wafer preparation electromechanical appliance.
Duty Rate — China → United States
20.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Document tolerance specifications (micron-level) to prove semiconductor precision requirements
• Separate diamond grinding wheels if imported unmounted to use lower duty tools provisions
• Conduct country-of-origin analysis for motor components affecting final classification