Wafer Lapping Machine
Mechanical apparatus that uses abrasive slurries to lap semiconductor wafers to precise thickness and flatness tolerances before polishing. Removes saw damage and achieves planarity critical for device fabrication. Under HTS 8479.79.00.00 as preparatory semiconductor processing equipment.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If general lapping/polishing machines
Chapter 84 covers generic abrasive finishing machines outside semiconductor notes.
If as listed wafer preparation equipment
Statistical notes explicitly include wafer grinders, lappers, polishers in 8486.
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Import Tips & Compliance
• Specify flatness specs (e.g
• <1μm TTV); include slurry handling system details
• Pitfall: overlap with general polishing machines
Related Products under HTS 8479.79.00.00
Czochralski Crystal Puller
A machine used to produce monocrystalline silicon boules by slowly pulling a seed crystal from molten silicon in the Czochralski method. It is essential for semiconductor wafer manufacturing as it creates the pure crystal ingots from which wafers are sliced. Classified under HTS 8479.79.00.00 as a machine having individual function not specified elsewhere for semiconductor material growth.
Float Zone Crystal Grower
Equipment employing the float zone method to purify and grow monocrystalline semiconductor boules without a crucible, ideal for high-purity silicon and gallium arsenide. Used in initial stages of semiconductor material processing before wafer slicing. Falls under HTS 8479.79.00.00 as specialized machinery not elsewhere specified.
Crystal Boule Grinder
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds flats indicating conductivity type and resistivity. Critical step in wafer preparation after growth. Classified in HTS 8479.79.00.00 for mechanical preparation machines in semiconductor processing.
Semiconductor Wafer Slicing Saw
High-precision inner-diameter saw designed to slice ultra-thin wafers from monocrystalline semiconductor boules with minimal material loss. Ensures flatness and minimal subsurface damage for subsequent processing. HTS 8479.79.00.00 applies to this specialized slicing apparatus.
Single Wafer Polishing Tool
Advanced polisher that processes individual semiconductor wafers using chemical-mechanical planarization (CMP) to achieve mirror-like surface finish. Prepares wafers for photolithography and device formation. Classified HTS 8479.79.00.00 for specialized surface finishing machinery.
Gallium Arsenide Crystal Puller
Specialized vertical Bridgman or LEC puller designed for compound semiconductors like GaAs boule growth from molten flux. Accommodates high-pressure and reactive atmospheres required for III-V materials. HTS 8479.79.00.00 for compound semiconductor growth equipment.