8479.79.00.00/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Mechanical apparatus that uses abrasive slurries to lap semiconductor wafers to precise thickness and flatness tolerances before polishing. Removes saw damage and achieves planarity critical for device fabrication. Under HTS 8479.79.00.00 as preparatory semiconductor processing equipment.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify flatness specs (e.g

• <1μm TTV); include slurry handling system details

• Pitfall: overlap with general polishing machines

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8479.79.00.00