Wafer Lapping Machine from Canada
Mechanical apparatus that uses abrasive slurries to lap semiconductor wafers to precise thickness and flatness tolerances before polishing. Removes saw damage and achieves planarity critical for device fabrication. Under HTS 8479.79.00.00 as preparatory semiconductor processing equipment.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify flatness specs (e.g
• <1μm TTV); include slurry handling system details
• Pitfall: overlap with general polishing machines