Wafer Lapping Machine from Germany
Mechanical apparatus that uses abrasive slurries to lap semiconductor wafers to precise thickness and flatness tolerances before polishing. Removes saw damage and achieves planarity critical for device fabrication. Under HTS 8479.79.00.00 as preparatory semiconductor processing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify flatness specs (e.g
• <1μm TTV); include slurry handling system details
• Pitfall: overlap with general polishing machines